SZN6312DTX
vs
MSP1N5236CUR-1TR
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
SOLID STATE DEVICES INC
MICROSEMI CORP
Package Description
O-LALF-W2
O-LELF-R2
Pin Count
2
2
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Additional Feature
METALLURGICALLY BONDED
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JESD-30 Code
O-LALF-W2
O-LELF-R2
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
175 °C
175 °C
Operating Temperature-Min
-65 °C
-65 °C
Package Body Material
GLASS
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.5 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3.3 V
7.5 V
Surface Mount
NO
YES
Technology
ZENER
ZENER
Terminal Form
WIRE
WRAP AROUND
Terminal Position
AXIAL
END
Voltage Tol-Max
1%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
1
1
Rohs Code
Part Package Code
DO-213AA
JEDEC-95 Code
DO-213AA
JESD-609 Code
e0
Moisture Sensitivity Level
1
Reference Standard
MIL-19500
Terminal Finish
TIN LEAD
Compare SZN6312DTX with alternatives
Compare MSP1N5236CUR-1TR with alternatives