SZN5952S vs CDLL5952B feature comparison

SZN5952S Solid State Devices Inc (SSDI)

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CDLL5952B Microchip Technology Inc

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Part Life Cycle Code Active Active
Ihs Manufacturer SOLID STATE DEVICES INC MICROCHIP TECHNOLOGY INC
Package Description O-LALF-W2 HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2
Reach Compliance Code compliant compliant
ECCN Code EAR99
HTS Code 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-LELF-R2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C
Operating Temperature-Min -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 130 V
Surface Mount NO YES
Technology ZENER ZENER
Terminal Form WIRE WRAP AROUND
Terminal Position AXIAL END
Voltage Tol-Max 5% 5%
Working Test Current 2.9 mA 2.9 mA
Base Number Matches 1 2
Rohs Code No
Factory Lead Time 14 Weeks
Additional Feature HIGH RELIABILITY
JEDEC-95 Code DO-213AB
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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