SZN4482 vs JAN1N4482C feature comparison

SZN4482 Solid State Devices Inc (SSDI)

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JAN1N4482C Microsemi Corporation

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Part Life Cycle Code Active Transferred
Ihs Manufacturer SOLID STATE DEVICES INC MICROSEMI CORP
Package Description O-LALF-W2 HERMETIC SEALED, GLASS PACKAGE-2
Pin Count 2 2
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8541.10.00.50 8541.10.00.50
Case Connection ISOLATED ISOLATED
Configuration SINGLE SINGLE
Diode Element Material SILICON SILICON
Diode Type ZENER DIODE ZENER DIODE
JESD-30 Code O-LALF-W2 O-LALF-W2
Number of Elements 1 1
Number of Terminals 2 2
Operating Temperature-Max 175 °C 175 °C
Operating Temperature-Min -65 °C -65 °C
Package Body Material GLASS GLASS
Package Shape ROUND ROUND
Package Style LONG FORM LONG FORM
Polarity UNIDIRECTIONAL UNIDIRECTIONAL
Power Dissipation-Max 1.5 W 1.5 W
Qualification Status Not Qualified Not Qualified
Reference Voltage-Nom 51 V 51 V
Surface Mount NO NO
Technology ZENER ZENER
Terminal Form WIRE WIRE
Terminal Position AXIAL AXIAL
Voltage Tol-Max 5% 2%
Working Test Current 5 mA 5 mA
Base Number Matches 39 2
Pbfree Code No
Rohs Code No
Part Package Code DO-41
Additional Feature HIGH RELIABILITY, METALLURGICALLY BONDED
JEDEC-95 Code DO-41
JESD-609 Code e0
Reference Standard MIL-19500
Terminal Finish TIN LEAD

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