SZMMBZ5225BLT1
vs
MSP1N5225CUR-1TR
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
ON SEMICONDUCTOR
MICROSEMI CORP
Part Package Code
SOT-23
DO-213AA
Package Description
PLASTIC, CASE 318-08, TO-236, 3 PIN
HERMETIC SEALED, GLASS, MLL34, MELF-2
Pin Count
3
2
Manufacturer Package Code
CASE 318-08
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8541.10.00.50
8541.10.00.50
Factory Lead Time
4 Weeks
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
JEDEC-95 Code
TO-236AB
DO-213AA
JESD-30 Code
R-PDSO-G3
O-LELF-R2
JESD-609 Code
e0
e0
Moisture Sensitivity Level
1
1
Number of Elements
1
1
Number of Terminals
3
2
Package Body Material
PLASTIC/EPOXY
GLASS
Package Shape
RECTANGULAR
ROUND
Package Style
SMALL OUTLINE
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
0.225 W
0.5 W
Qualification Status
Not Qualified
Not Qualified
Reference Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
TIN LEAD
Terminal Form
GULL WING
WRAP AROUND
Terminal Position
DUAL
END
Voltage Tol-Max
5%
2%
Working Test Current
20 mA
20 mA
Base Number Matches
3
1
Case Connection
ISOLATED
Operating Temperature-Max
175 °C
Operating Temperature-Min
-65 °C
Reference Standard
MIL-19500
Compare SZMMBZ5225BLT1 with alternatives
Compare MSP1N5225CUR-1TR with alternatives