SYS82000RKXI-10
vs
5962-9562402HNX
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MOSAIC SEMICONDUCTOR INC
WHITE ELECTRONIC DESIGNS CORP
Part Package Code
MODULE
Package Description
,
QFP-68
Pin Count
36
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A001.A.2.C
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
100 ns
100 ns
JESD-30 Code
R-XSMA-T36
S-XQFP-F68
Memory Density
16777216 bit
16777216 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
8
32
Number of Functions
1
1
Number of Terminals
36
68
Number of Words
2097152 words
524288 words
Number of Words Code
2000000
512000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Organization
2MX8
512KX32
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
SQUARE
Package Style
MICROELECTRONIC ASSEMBLY
FLATPACK
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
YES
Technology
CMOS
CMOS
Terminal Form
THROUGH-HOLE
FLAT
Terminal Position
SINGLE
QUAD
Base Number Matches
2
4
Additional Feature
CONFIGURABLE AS 2M X 8
Alternate Memory Width
16
Length
39.625 mm
Operating Temperature-Max
125 °C
Operating Temperature-Min
-55 °C
Package Code
QFF
Seated Height-Max
5.1 mm
Temperature Grade
MILITARY
Terminal Pitch
1.27 mm
Width
39.625 mm
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