SYS82000FKXLI-70
vs
WS512K32-120HCE
feature comparison
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MOSAIC SEMICONDUCTOR INC
|
WHITE ELECTRONIC DESIGNS CORP
|
Part Package Code |
MODULE
|
|
Package Description |
,
|
1.185 X 1.185 INCH, HERMETIC SEALED, CERAMIC, HIP-66
|
Pin Count |
36
|
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
3A991.B.2.A
|
|
HTS Code |
8542.32.00.41
|
|
Access Time-Max |
70 ns
|
120 ns
|
JESD-30 Code |
R-XDMA-T36
|
S-CPGA-P66
|
Memory Density |
16777216 bit
|
16777216 bit
|
Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
36
|
66
|
Number of Words |
2097152 words
|
2097152 words
|
Number of Words Code |
2000000
|
2000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
-40 °C
|
|
Organization |
2MX8
|
2MX8
|
Package Body Material |
UNSPECIFIED
|
CERAMIC, METAL-SEALED COFIRED
|
Package Shape |
RECTANGULAR
|
SQUARE
|
Package Style |
MICROELECTRONIC ASSEMBLY
|
GRID ARRAY
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
Surface Mount |
NO
|
NO
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
Terminal Position |
DUAL
|
PERPENDICULAR
|
Base Number Matches |
1
|
2
|
Rohs Code |
|
No
|
Additional Feature |
|
CONFIGURABLE AS 512K X 32 OR 1024K X 16
|
JESD-609 Code |
|
e4
|
Length |
|
30.1 mm
|
Package Code |
|
PGA
|
Seated Height-Max |
|
6.22 mm
|
Terminal Finish |
|
GOLD
|
Terminal Pitch |
|
2.54 mm
|
Width |
|
30.1 mm
|
|
|
|
Compare SYS82000FKXLI-70 with alternatives
Compare WS512K32-120HCE with alternatives