SYS82000FKXLI-12
vs
WS512K32N-120H2ME
feature comparison
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
APTA GROUP INC
|
WHITE MICROELECTRONICS
|
| Part Package Code |
MODULE
|
|
| Package Description |
DIP, DIP36,.6
|
|
| Pin Count |
36
|
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
3A991.B.2.A
|
3A001.A.2.C
|
| HTS Code |
8542.32.00.41
|
8542.32.00.41
|
| Access Time-Max |
120 ns
|
120 ns
|
| I/O Type |
COMMON
|
|
| JESD-30 Code |
R-PDMA-T36
|
S-CHMA-P66
|
| Memory Density |
16777216 bit
|
16777216 bit
|
| Memory IC Type |
SRAM MODULE
|
SRAM MODULE
|
| Memory Width |
8
|
8
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
36
|
66
|
| Number of Words |
2097152 words
|
2097152 words
|
| Number of Words Code |
2000000
|
2000000
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
125 °C
|
| Operating Temperature-Min |
-40 °C
|
-55 °C
|
| Organization |
2MX8
|
2MX8
|
| Output Characteristics |
3-STATE
|
|
| Package Body Material |
PLASTIC/EPOXY
|
CERAMIC, METAL-SEALED COFIRED
|
| Package Code |
DIP
|
|
| Package Equivalence Code |
DIP36,.6
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Standby Current-Max |
0.00028 A
|
|
| Standby Voltage-Min |
2 V
|
|
| Supply Current-Max |
0.109 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
MILITARY
|
| Terminal Form |
THROUGH-HOLE
|
PIN/PEG
|
| Terminal Pitch |
2.54 mm
|
|
| Terminal Position |
DUAL
|
HEX
|
| Base Number Matches |
2
|
2
|
| Additional Feature |
|
CONFIGURABLE AS 512K X 32 OR 1024K X 16
|
|
|
|
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