SYS82000FKXAL-85 vs EDI8F82045C85B6C feature comparison

SYS82000FKXAL-85 Mosaic Semiconductor Inc

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EDI8F82045C85B6C White Electronic Designs Corp

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MOSAIC SEMICONDUCTOR INC WHITE ELECTRONIC DESIGNS CORP
Part Package Code DIP
Package Description , DIP-36
Pin Count 36
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 85 ns 85 ns
JESD-30 Code R-PDIP-T36 R-XDMA-T36
Memory Density 16777216 bit 16777216 bit
Memory IC Type SRAM MODULE SRAM MODULE
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 36 36
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX8 2MX8
Package Body Material PLASTIC/EPOXY UNSPECIFIED
Package Shape RECTANGULAR RECTANGULAR
Package Style IN-LINE MICROELECTRONIC ASSEMBLY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 4.5 V 4.5 V
Supply Voltage-Nom (Vsup) 5 V 5 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Form THROUGH-HOLE THROUGH-HOLE
Terminal Position DUAL DUAL
Base Number Matches 2 2
Rohs Code No
I/O Type COMMON
Output Characteristics 3-STATE
Package Code DIP
Package Equivalence Code DIP36,.6
Peak Reflow Temperature (Cel) NOT SPECIFIED
Standby Current-Max 0.003 A
Standby Voltage-Min 4.5 V
Supply Current-Max 0.15 mA
Terminal Pitch 2.54 mm
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

Compare SYS82000FKXAL-85 with alternatives

Compare EDI8F82045C85B6C with alternatives