SYS32256ZKI-25
vs
SYS32256ZKLI-12
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MOSAIC SEMICONDUCTOR INC
MOSAIC SEMICONDUCTOR INC
Part Package Code
ZIP
ZIP
Package Description
,
,
Pin Count
64
64
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
25 ns
12 ns
JESD-30 Code
R-XZMA-T64
R-XZMA-T64
Memory Density
8388608 bit
8388608 bit
Memory IC Type
SRAM MODULE
SRAM MODULE
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
64
64
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
256KX32
256KX32
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Supply Voltage-Max (Vsup)
5.5 V
5.5 V
Supply Voltage-Min (Vsup)
4.5 V
4.5 V
Supply Voltage-Nom (Vsup)
5 V
5 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
THROUGH-HOLE
THROUGH-HOLE
Terminal Position
ZIG-ZAG
ZIG-ZAG
Base Number Matches
2
2
Compare SYS32256ZKI-25 with alternatives
Compare SYS32256ZKLI-12 with alternatives