SY89876LMITR
vs
SY89876LMI
feature comparison
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
DFN
|
| Package Description |
MLF-16
|
MLF-16
|
| Pin Count |
16
|
16
|
| Manufacturer Package Code |
MLF
|
MLF
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
89876
|
89876
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
| Number of Functions |
1
|
1
|
| Number of Inverted Outputs |
|
|
| Number of Terminals |
16
|
16
|
| Number of True Outputs |
4
|
4
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Power Supply Current-Max (ICC) |
100 mA
|
100 mA
|
| Prop. Delay@Nom-Sup |
0.87 ns
|
0.87 ns
|
| Propagation Delay (tpd) |
0.87 ns
|
0.87 ns
|
| Same Edge Skew-Max (tskwd) |
0.015 ns
|
0.015 ns
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
3 mm
|
3 mm
|
| fmax-Min |
2000 MHz
|
2000 MHz
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare SY89876LMITR with alternatives
Compare SY89876LMI with alternatives