SY89831UUMG
vs
SY89831UUMI-TR
feature comparison
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
Package Description |
QCCN, LCC16,.12SQ,20
|
,
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
89831
|
89831
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-PQCC-N16
|
S-PQCC-N16
|
Length |
3 mm
|
3 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
4
|
4
|
Number of Terminals |
16
|
16
|
Number of True Outputs |
4
|
4
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HVQCCN
|
HVQCCN
|
Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
Power Supply Current-Max (ICC) |
70 mA
|
70 mA
|
Prop. Delay@Nom-Sup |
0.45 ns
|
0.45 ns
|
Propagation Delay (tpd) |
0.45 ns
|
0.45 ns
|
Qualification Status |
Not Qualified
|
|
Same Edge Skew-Max (tskwd) |
0.02 ns
|
0.02 ns
|
Seated Height-Max |
0.95 mm
|
0.95 mm
|
Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Form |
NO LEAD
|
NO LEAD
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
3 mm
|
3 mm
|
fmax-Min |
2000 MHz
|
2000 MHz
|
Base Number Matches |
1
|
1
|
Packing Method |
|
TR
|
|
|
|
Compare SY89831UUMG with alternatives
Compare SY89831UUMI-TR with alternatives