SY89826LHI vs SY89826LHG feature comparison

SY89826LHI Microchip Technology Inc

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SY89826LHG Micrel Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICREL INC MICREL INC
Part Package Code QFP QFP
Package Description HTFQFP, TQFP64,.47SQ LEAD FREE, TQFP-64
Pin Count 64 64
Reach Compliance Code not_compliant compliant
HTS Code 8542.39.00.01 8542.39.00.01
Family 89826 89826
Input Conditioning DIFFERENTIAL MUX DIFFERENTIAL MUX
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e0 e4
Length 10 mm 10 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level 3 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 64 64
Number of True Outputs 22 22
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTFQFP HTFQFP
Package Equivalence Code TQFP64,.47SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240 260
Prop. Delay@Nom-Sup 1.45 ns
Propagation Delay (tpd) 1.45 ns 1.45 ns
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.075 ns 0.075 ns
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30 40
Width 10 mm 10 mm
fmax-Min 1000 MHz 1000 MHz
Base Number Matches 2 2

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