SY89826LHI
vs
MC100EP223TC
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
MOTOROLA INC
|
Part Package Code |
QFP
|
QFP
|
Package Description |
HTFQFP, TQFP64,.47SQ
|
HLFQFP, QFP64,.47SQ,20
|
Pin Count |
64
|
64
|
Reach Compliance Code |
not_compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
89826
|
100E
|
Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e0
|
e0
|
Length |
10 mm
|
10 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
3
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
64
|
64
|
Number of True Outputs |
22
|
22
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
HTFQFP
|
HLFQFP
|
Package Equivalence Code |
TQFP64,.47SQ
|
QFP64,.47SQ,20
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
|
FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
|
Peak Reflow Temperature (Cel) |
240
|
|
Prop. Delay@Nom-Sup |
1.45 ns
|
|
Propagation Delay (tpd) |
1.45 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.075 ns
|
0.05 ns
|
Seated Height-Max |
1.2 mm
|
1.6 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
OTHER
|
Terminal Finish |
Tin/Lead (Sn85Pb15)
|
TIN LEAD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.5 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Width |
10 mm
|
10 mm
|
fmax-Min |
1000 MHz
|
|
Base Number Matches |
2
|
1
|
Technology |
|
ECL
|
|
|
|
Compare SY89826LHI with alternatives
Compare MC100EP223TC with alternatives