SY89826LHI vs MC100EP223TC feature comparison

SY89826LHI Microchip Technology Inc

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MC100EP223TC Motorola Mobility LLC

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICREL INC MOTOROLA INC
Part Package Code QFP QFP
Package Description HTFQFP, TQFP64,.47SQ HLFQFP, QFP64,.47SQ,20
Pin Count 64 64
Reach Compliance Code not_compliant unknown
HTS Code 8542.39.00.01 8542.39.00.01
Family 89826 100E
Input Conditioning DIFFERENTIAL MUX DIFFERENTIAL MUX
JESD-30 Code S-PQFP-G64 S-PQFP-G64
JESD-609 Code e0 e0
Length 10 mm 10 mm
Logic IC Type LOW SKEW CLOCK DRIVER LOW SKEW CLOCK DRIVER
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 64 64
Number of True Outputs 22 22
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code HTFQFP HLFQFP
Package Equivalence Code TQFP64,.47SQ QFP64,.47SQ,20
Package Shape SQUARE SQUARE
Package Style FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH FLATPACK, HEAT SINK/SLUG, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 240
Prop. Delay@Nom-Sup 1.45 ns
Propagation Delay (tpd) 1.45 ns
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.075 ns 0.05 ns
Seated Height-Max 1.2 mm 1.6 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade INDUSTRIAL OTHER
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 0.5 mm 0.5 mm
Terminal Position QUAD QUAD
Time@Peak Reflow Temperature-Max (s) 30
Width 10 mm 10 mm
fmax-Min 1000 MHz
Base Number Matches 2 1
Technology ECL

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Compare MC100EP223TC with alternatives