SY89824LHC
vs
IDT23S05-1HDCGI8
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICREL INC
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFP
SOIC
Package Description
TQFP-64
0.150 INCH, GREEN, MS-012, SOIC-8
Pin Count
64
8
Reach Compliance Code
not_compliant
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
89824
23S
Input Conditioning
DIFFERENTIAL MUX
STANDARD
JESD-30 Code
S-PQFP-G64
R-PDSO-G8
JESD-609 Code
e0
e3
Length
10 mm
4.9 mm
Logic IC Type
LOW SKEW CLOCK DRIVER
PLL BASED CLOCK DRIVER
Moisture Sensitivity Level
3
1
Number of Functions
1
1
Number of Inverted Outputs
Number of Terminals
64
8
Number of True Outputs
22
4
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HTFQFP
SOP
Package Equivalence Code
TQFP64,.47SQ
SOP8,.25
Package Shape
SQUARE
RECTANGULAR
Package Style
FLATPACK, HEAT SINK/SLUG, THIN PROFILE, FINE PITCH
SMALL OUTLINE
Peak Reflow Temperature (Cel)
240
260
Propagation Delay (tpd)
1 ns
0.35 ns
Qualification Status
Not Qualified
Not Qualified
Same Edge Skew-Max (tskwd)
0.05 ns
0.25 ns
Seated Height-Max
1.2 mm
1.7272 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
ECL
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Lead (Sn85Pb15)
Matte Tin (Sn) - annealed
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
1.27 mm
Terminal Position
QUAD
DUAL
Time@Peak Reflow Temperature-Max (s)
30
30
Width
10 mm
3.9 mm
Base Number Matches
2
2
ECCN Code
EAR99
Max I(ol)
0.032 A
fmax-Min
133 MHz
Compare SY89824LHC with alternatives
Compare IDT23S05-1HDCGI8 with alternatives