SY89809ALTZ-TR vs IDT23S09E-1HPGG8 feature comparison

SY89809ALTZ-TR Microchip Technology Inc

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IDT23S09E-1HPGG8 Renesas Electronics Corporation

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Rohs Code Yes Yes
Part Life Cycle Code Active Obsolete
Ihs Manufacturer MICROCHIP TECHNOLOGY INC RENESAS ELECTRONICS CORP
Package Description TQFP, TSSOP, TSSOP16,.25
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.39.00.01 8542.39.00.01
Factory Lead Time 8 Weeks
Samacsys Manufacturer Microchip
Family 89809 23S
Input Conditioning DIFFERENTIAL MUX STANDARD
JESD-30 Code S-PQFP-G32 R-PDSO-G16
JESD-609 Code e3 e3
Length 7 mm 5 mm
Logic IC Type LOW SKEW CLOCK DRIVER PLL BASED CLOCK DRIVER
Moisture Sensitivity Level 2 1
Number of Functions 1 1
Number of Inverted Outputs
Number of Terminals 32 16
Number of True Outputs 9 9
Operating Temperature-Max 85 °C 70 °C
Operating Temperature-Min
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TQFP TSSOP
Package Shape SQUARE RECTANGULAR
Package Style FLATPACK, THIN PROFILE SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Packing Method TR
Peak Reflow Temperature (Cel) 260 260
Propagation Delay (tpd) 1.11 ns
Qualification Status Not Qualified Not Qualified
Same Edge Skew-Max (tskwd) 0.025 ns 0.25 ns
Seated Height-Max 1.2 mm 1.2 mm
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Temperature Grade OTHER COMMERCIAL
Terminal Finish MATTE TIN Matte Tin (Sn) - annealed
Terminal Form GULL WING GULL WING
Terminal Pitch 0.8 mm 0.65 mm
Terminal Position QUAD DUAL
Time@Peak Reflow Temperature-Max (s) 40 30
Width 7 mm 4.4 mm
Base Number Matches 1 2
Max I(ol) 0.012 A
Output Characteristics 3-STATE
Package Equivalence Code TSSOP16,.25
fmax-Min 200 MHz

Compare SY89809ALTZ-TR with alternatives

Compare IDT23S09E-1HPGG8 with alternatives