SY89809ALTZ-TR
vs
IDT23S09E-1HPGG8
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Obsolete
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
RENESAS ELECTRONICS CORP
|
Package Description |
TQFP,
|
TSSOP, TSSOP16,.25
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Factory Lead Time |
8 Weeks
|
|
Samacsys Manufacturer |
Microchip
|
|
Family |
89809
|
23S
|
Input Conditioning |
DIFFERENTIAL MUX
|
STANDARD
|
JESD-30 Code |
S-PQFP-G32
|
R-PDSO-G16
|
JESD-609 Code |
e3
|
e3
|
Length |
7 mm
|
5 mm
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
PLL BASED CLOCK DRIVER
|
Moisture Sensitivity Level |
2
|
1
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
32
|
16
|
Number of True Outputs |
9
|
9
|
Operating Temperature-Max |
85 °C
|
70 °C
|
Operating Temperature-Min |
|
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TQFP
|
TSSOP
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK, THIN PROFILE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Packing Method |
TR
|
|
Peak Reflow Temperature (Cel) |
260
|
260
|
Propagation Delay (tpd) |
1.11 ns
|
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.025 ns
|
0.25 ns
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
3 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
OTHER
|
COMMERCIAL
|
Terminal Finish |
MATTE TIN
|
Matte Tin (Sn) - annealed
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
7 mm
|
4.4 mm
|
Base Number Matches |
1
|
2
|
Max I(ol) |
|
0.012 A
|
Output Characteristics |
|
3-STATE
|
Package Equivalence Code |
|
TSSOP16,.25
|
fmax-Min |
|
200 MHz
|
|
|
|
Compare SY89809ALTZ-TR with alternatives
Compare IDT23S09E-1HPGG8 with alternatives