SY89295UMGTR
vs
SY100EP196VTCTR
feature comparison
Pbfree Code |
Yes
|
No
|
Rohs Code |
Yes
|
No
|
Part Life Cycle Code |
Transferred
|
Transferred
|
Ihs Manufacturer |
MICREL INC
|
MICREL INC
|
Part Package Code |
DFN
|
QFP
|
Package Description |
VQCCN,
|
TQFP,
|
Pin Count |
32
|
32
|
Manufacturer Package Code |
MLF
|
|
Reach Compliance Code |
compliant
|
compliant
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Additional Feature |
ALSO OPERATES WITH 3.3V NOMINAL SUPPLY VOLTAGE
|
NECL MODE: VCC=0 WITH VEE= -3.0V TO -5.5V
|
Family |
CMOS
|
100E
|
JESD-30 Code |
S-XQCC-N32
|
S-PQFP-G32
|
JESD-609 Code |
e4
|
e0
|
Length |
5 mm
|
7 mm
|
Logic IC Type |
ACTIVE DELAY LINE
|
ACTIVE DELAY LINE
|
Moisture Sensitivity Level |
2
|
2
|
Number of Functions |
1
|
1
|
Number of Taps/Steps |
1023
|
1023
|
Number of Terminals |
32
|
32
|
Operating Temperature-Max |
85 °C
|
|
Operating Temperature-Min |
-40 °C
|
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
Package Code |
VQCCN
|
TQFP
|
Package Equivalence Code |
LCC32,.2SQ,20
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER, VERY THIN PROFILE
|
FLATPACK, THIN PROFILE
|
Packing Method |
TR
|
TR
|
Peak Reflow Temperature (Cel) |
260
|
240
|
Programmable Delay Line |
YES
|
YES
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
0.9 mm
|
1.2 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
5.5 V
|
Supply Voltage-Min (Vsup) |
2.375 V
|
3 V
|
Supply Voltage-Nom (Vsup) |
2.5 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Temperature Grade |
INDUSTRIAL
|
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
NO LEAD
|
GULL WING
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
Width |
5 mm
|
7 mm
|
Base Number Matches |
2
|
2
|
Technology |
|
ECL
|
Total Delay-Nom (td) |
|
12.2 ns
|
|
|
|
Compare SY89295UMGTR with alternatives
Compare SY100EP196VTCTR with alternatives