SY88893VKG
vs
MAX3747AEUB+
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Not Recommended
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
|
| Package Description |
3 X 3 MM, LEAD FREE, MSOP-10
|
|
| Reach Compliance Code |
compliant
|
|
| HTS Code |
8542.39.00.01
|
|
| JESD-30 Code |
S-PDSO-G10
|
S-PDSO-N10
|
| JESD-609 Code |
e4
|
e3
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
SON
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
0.8 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Telecom IC Type |
ATM/SONET/SDH SUPPORT CIRCUIT
|
ATM/SONET/SDH SUPPORT CIRCUIT
|
| Temperature Grade |
OTHER
|
INDUSTRIAL
|
| Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
Matte Tin (Sn)
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
2
|
| Part Package Code |
|
10-MINI_SO-N/A
|
| Pin Count |
|
10
|
| Manufacturer Package Code |
|
10-MINI_SO-N/A
|
| Date Of Intro |
|
2004-06-02
|
| Samacsys Manufacturer |
|
Analog Devices
|
| Applications |
|
SONET
|
| Package Equivalence Code |
|
TSSOP10,.19,20
|
| Supply Current-Max |
|
0.041 mA
|
| Technology |
|
BIPOLAR
|
|
|
|
Compare SY88893VKG with alternatives
Compare MAX3747AEUB+ with alternatives