SY58027UMITR
vs
SY58027UMI
feature comparison
| Rohs Code |
No
|
No
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Part Package Code |
DFN
|
DFN
|
| Package Description |
MLF-32
|
MLF-32
|
| Pin Count |
32
|
32
|
| Manufacturer Package Code |
MLF
|
MLF
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Additional Feature |
SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY
|
SEATED HT-CALCULATED; ALSO OPERATES AT 3.3V SUPPLY
|
| Family |
58027
|
58027
|
| Input Conditioning |
DIFFERENTIAL MUX
|
DIFFERENTIAL MUX
|
| JESD-30 Code |
S-XQCC-N32
|
S-XQCC-N32
|
| Length |
5 mm
|
5 mm
|
| Logic IC Type |
MULTIPLEXER
|
MULTIPLEXER
|
| Number of Functions |
2
|
2
|
| Number of Inputs |
2
|
2
|
| Number of Inverted Outputs |
|
|
| Number of Outputs |
1
|
1
|
| Number of Terminals |
32
|
32
|
| Number of True Outputs |
2
|
2
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC32,.2SQ,20
|
LCC32,.2SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Packing Method |
TR
|
|
| Power Supply Current-Max (ICC) |
140 mA
|
140 mA
|
| Propagation Delay (tpd) |
0.29 ns
|
0.29 ns
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
5 mm
|
5 mm
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare SY58027UMITR with alternatives
Compare SY58027UMI with alternatives