SY55852UKC
vs
SY55852UKG
feature comparison
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICREL INC
|
MICREL INC
|
| Part Package Code |
MSOP
|
|
| Package Description |
MSOP-10
|
LEAD FREE, MSOP-10
|
| Pin Count |
10
|
|
| Reach Compliance Code |
not_compliant
|
compliant
|
| HTS Code |
8542.39.00.01
|
|
| Family |
55852
|
55852
|
| JESD-30 Code |
S-PDSO-G10
|
S-PDSO-G10
|
| JESD-609 Code |
e0
|
e4
|
| Length |
3 mm
|
3 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Max Frequency@Nom-Sup |
2500000 Hz
|
2500000 Hz
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Bits |
1
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP10,.19,20
|
TSSOP10,.19,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
240
|
260
|
| Power Supply Current-Max (ICC) |
36 mA
|
36 mA
|
| Prop. Delay@Nom-Sup |
0.4 ns
|
0.4 ns
|
| Propagation Delay (tpd) |
0.4 ns
|
0.4 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Max (Vsup) |
5.7 V
|
5.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
Tin/Lead (Sn85Pb15)
|
Nickel/Palladium/Gold (Ni/Pd/Au)
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
40
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
3 mm
|
3 mm
|
| fmax-Min |
2500 MHz
|
2500 MHz
|
| Base Number Matches |
2
|
2
|
|
|
|
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