SY54023ARMGTR
vs
SY54023ARMG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
HVQCCN, LCC16,.12SQ,20
|
MLF-16
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
CROSS POINT SWITCH
|
CROSS POINT SWITCH
|
| Input Voltage-Max |
1 V
|
1 V
|
| Input Voltage-Min |
0.1 V
|
0.1 V
|
| JESD-30 Code |
S-XQCC-N16
|
S-XQCC-N16
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
|
| Number of Channels |
2
|
2
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
16
|
16
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Output |
SEPARATE OUTPUT
|
SEPARATE OUTPUT
|
| Package Body Material |
UNSPECIFIED
|
UNSPECIFIED
|
| Package Code |
HVQCCN
|
HVQCCN
|
| Package Equivalence Code |
LCC16,.12SQ,20
|
LCC16,.12SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Seated Height-Max |
0.9 mm
|
0.9 mm
|
| Supply Current-Max (Isup) |
50 mA
|
50 mA
|
| Supply Voltage-Max (Vsup) |
2.625 V
|
2.625 V
|
| Supply Voltage-Min (Vsup) |
2.375 V
|
2.375 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
3
|
| Factory Lead Time |
|
4 Weeks
|
| Samacsys Manufacturer |
|
Microchip
|
|
|
|
Compare SY54023ARMGTR with alternatives
Compare SY54023ARMG with alternatives