SY10EP01VZI vs MC10EP01DR2 feature comparison

SY10EP01VZI Microchip Technology Inc

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MC10EP01DR2 onsemi

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Rohs Code No No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICREL INC ON SEMICONDUCTOR
Part Package Code SOIC SOIC
Package Description PLASTIC, SOIC-8 SOIC-8
Pin Count 8 8
Reach Compliance Code not_compliant not_compliant
HTS Code 8542.39.00.01 8542.39.00.01
Additional Feature ALSO OPERATES WITH VEE = -3.0V TO -5.5V WITH VCC = 0V NECL MODE: VCC = 0V WITH VEE = -3V TO -5.5V
Family 10E 10E
JESD-30 Code R-PDSO-G8 R-PDSO-G8
JESD-609 Code e0 e0
Length 4.93 mm 4.9 mm
Logic IC Type OR/NOR GATE OR/NOR GATE
Moisture Sensitivity Level 1 1
Number of Functions 1 1
Number of Inputs 4 4
Number of Terminals 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code SOP SOP
Package Equivalence Code SOP8,.25 SOP8,.25
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE SMALL OUTLINE
Peak Reflow Temperature (Cel) 240 235
Power Supply Current-Max (ICC) 31 mA 31 mA
Prop. Delay@Nom-Sup 0.3 ns 0.35 ns
Propagation Delay (tpd) 0.25 ns 0.33 ns
Qualification Status Not Qualified Not Qualified
Schmitt Trigger NO NO
Seated Height-Max 1.73 mm 1.75 mm
Supply Voltage-Max (Vsup) 5.5 V 5.5 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology ECL ECL
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn85Pb15) TIN LEAD
Terminal Form GULL WING GULL WING
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30
Width 3.94 mm 3.9 mm
Base Number Matches 2 1
Packing Method TR

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