SY10E112JI
vs
SY10E112JCTR
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Transferred
|
Not Recommended
|
| Ihs Manufacturer |
SYNERGY SEMICONDUCTOR CORP
|
MICROCHIP TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| Additional Feature |
STROBED O/PS
|
|
| Family |
10E
|
10E
|
| JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
| JESD-609 Code |
e0
|
|
| Logic IC Type |
INVERTER/BUFFER
|
INVERTER/BUFFER
|
| Number of Functions |
4
|
4
|
| Number of Inputs |
1
|
1
|
| Number of Terminals |
28
|
28
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| Output Characteristics |
OPEN-EMITTER
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
QCCJ
|
| Package Equivalence Code |
LDCC28,.5SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
| Propagation Delay (tpd) |
0.6 ns
|
0.6 ns
|
| Qualification Status |
Not Qualified
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
ECL
|
ECL
|
| Temperature Grade |
INDUSTRIAL
|
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Base Number Matches |
3
|
3
|
| Package Description |
|
LCC-28
|
| HTS Code |
|
8542.39.00.01
|
| Length |
|
11.48 mm
|
| Packing Method |
|
TR
|
| Seated Height-Max |
|
4.57 mm
|
| Supply Voltage-Max (Vsup) |
|
-5.5 V
|
| Supply Voltage-Min (Vsup) |
|
-4.2 V
|
| Supply Voltage-Nom (Vsup) |
|
-5.2 V
|
| Width |
|
11.48 mm
|
|
|
|
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