SY10E111LJI
vs
SY10E111LJITR
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Active
|
Transferred
|
Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
SYNERGY SEMICONDUCTOR CORP
|
Package Description |
LCC-28
|
QCCJ, LDCC28,.5SQ
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
|
Family |
10E
|
10E
|
Input Conditioning |
DIFFERENTIAL
|
DIFFERENTIAL
|
JESD-30 Code |
S-PQCC-J28
|
S-PQCC-J28
|
JESD-609 Code |
e0
|
e0
|
Length |
11.48 mm
|
|
Logic IC Type |
LOW SKEW CLOCK DRIVER
|
LOW SKEW CLOCK DRIVER
|
Moisture Sensitivity Level |
1
|
|
Number of Functions |
1
|
1
|
Number of Inverted Outputs |
|
|
Number of Terminals |
28
|
28
|
Number of True Outputs |
9
|
9
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QCCJ
|
QCCJ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
CHIP CARRIER
|
CHIP CARRIER
|
Propagation Delay (tpd) |
0.73 ns
|
0.78 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Same Edge Skew-Max (tskwd) |
0.05 ns
|
0.075 ns
|
Seated Height-Max |
4.57 mm
|
|
Surface Mount |
YES
|
YES
|
Technology |
ECL
|
ECL
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN LEAD
|
Tin/Lead (Sn/Pb)
|
Terminal Form |
J BEND
|
J BEND
|
Terminal Pitch |
1.27 mm
|
1.27 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
11.48 mm
|
|
Base Number Matches |
2
|
2
|
Output Characteristics |
|
OPEN-EMITTER
|
Package Equivalence Code |
|
LDCC28,.5SQ
|
Prop. Delay@Nom-Sup |
|
0.73 ns
|
|
|
|
Compare SY10E111LJI with alternatives