SY100S331FC
vs
100355DMQB
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
MICREL INC
|
NATIONAL SEMICONDUCTOR CORP
|
Package Description |
QFF, QFL24,.4SQ
|
DIP, DIP24,.4
|
Reach Compliance Code |
compliant
|
unknown
|
HTS Code |
8542.39.00.01
|
8542.39.00.01
|
Family |
100S
|
100K
|
JESD-30 Code |
S-GQFP-F24
|
R-GDIP-T24
|
JESD-609 Code |
e0
|
e0
|
Length |
9.78 mm
|
|
Logic IC Type |
D FLIP-FLOP
|
D LATCH
|
Number of Bits |
1
|
4
|
Number of Functions |
3
|
1
|
Number of Terminals |
24
|
24
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
|
-55 °C
|
Output Polarity |
COMPLEMENTARY
|
COMPLEMENTARY
|
Package Body Material |
CERAMIC, GLASS-SEALED
|
CERAMIC, GLASS-SEALED
|
Package Code |
QFF
|
DIP
|
Package Equivalence Code |
QFL24,.4SQ
|
DIP24,.4
|
Package Shape |
SQUARE
|
RECTANGULAR
|
Package Style |
FLATPACK
|
IN-LINE
|
Peak Reflow Temperature (Cel) |
240
|
|
Power Supply Current-Max (ICC) |
80 mA
|
95 mA
|
Prop. Delay@Nom-Sup |
0.8 ns
|
2.6 ns
|
Propagation Delay (tpd) |
0.8 ns
|
2.7 ns
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Seated Height-Max |
2.29 mm
|
5.72 mm
|
Surface Mount |
YES
|
NO
|
Technology |
ECL
|
ECL
|
Temperature Grade |
OTHER
|
MILITARY
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Terminal Form |
FLAT
|
THROUGH-HOLE
|
Terminal Pitch |
1.27 mm
|
2.54 mm
|
Terminal Position |
QUAD
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
30
|
|
Trigger Type |
POSITIVE EDGE
|
LOW LEVEL
|
Width |
9.78 mm
|
10.16 mm
|
fmax-Min |
800 MHz
|
|
Base Number Matches |
2
|
1
|
Additional Feature |
|
FOUR 2:1 MUX FOLLOWED BY LATCH; WITH DUAL LATCH ENABLE; OPTEMP SPECIFIED AS TC
|
Load Capacitance (CL) |
|
3 pF
|
Number of Inputs |
|
2
|
Output Characteristics |
|
OPEN-EMITTER
|
Screening Level |
|
MIL-STD-883 Class B
|
|
|
|
Compare SY100S331FC with alternatives
Compare 100355DMQB with alternatives