SY100EL16VDKG-TR
vs
SY100EL16VOKG
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICROCHIP TECHNOLOGY INC
|
MICROCHIP TECHNOLOGY INC
|
| Package Description |
TSSOP,
|
3 X 3 MM, LEAD FREE, MSOP-10
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Factory Lead Time |
4 Weeks
|
|
| High Level Input Current-Max |
0.00015 A
|
|
| Input Characteristics |
STANDARD
|
DIFFERENTIAL
|
| Interface IC Type |
LINE RECEIVER
|
LINE RECEIVER
|
| Interface Standard |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
| JESD-30 Code |
R-PDSO-G10
|
S-PDSO-G10
|
| JESD-609 Code |
e4
|
e4
|
| Length |
3 mm
|
3 mm
|
| Moisture Sensitivity Level |
2
|
1
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
10
|
10
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
TSSOP
|
| Package Equivalence Code |
TSSOP10,.19,20
|
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Receive Delay-Max |
0.73 ns
|
0.65 ns
|
| Receiver Number of Bits |
1
|
1
|
| Seated Height-Max |
1.1 mm
|
1.1 mm
|
| Supply Voltage-Nom |
3.3 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
NICKEL PALLADIUM GOLD
|
NICKEL PALLADIUM GOLD
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
1
|
1
|
| Supply Voltage-Max |
|
3.8 V
|
| Supply Voltage-Min |
|
3 V
|
|
|
|
Compare SY100EL16VDKG-TR with alternatives
Compare SY100EL16VOKG with alternatives