SX5614
vs
1SS250TE85R
feature comparison
Pbfree Code |
No
|
|
Rohs Code |
No
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
SENSITRON SEMICONDUCTOR
|
TOSHIBA CORP
|
Package Description |
E-LALF-W2
|
|
Pin Count |
2
|
|
Reach Compliance Code |
compliant
|
unknown
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8541.10.00.80
|
8541.10.00.70
|
Additional Feature |
HIGH RELIABILITY, METALLURGICALLY BONDED
|
|
Application |
GENERAL PURPOSE
|
GENERAL PURPOSE
|
Case Connection |
ISOLATED
|
|
Configuration |
SINGLE
|
SINGLE
|
Diode Element Material |
SILICON
|
SILICON
|
Diode Type |
RECTIFIER DIODE
|
RECTIFIER DIODE
|
JESD-30 Code |
E-LALF-W2
|
R-PDSO-G3
|
JESD-609 Code |
e0
|
|
Number of Elements |
1
|
1
|
Number of Phases |
1
|
1
|
Number of Terminals |
2
|
3
|
Operating Temperature-Max |
175 °C
|
125 °C
|
Operating Temperature-Min |
-65 °C
|
|
Output Current-Max |
1 A
|
0.1 A
|
Package Body Material |
GLASS
|
PLASTIC/EPOXY
|
Package Shape |
ELLIPTICAL
|
RECTANGULAR
|
Package Style |
LONG FORM
|
SMALL OUTLINE
|
Qualification Status |
Not Qualified
|
Not Qualified
|
Reference Standard |
MIL-19500
|
|
Rep Pk Reverse Voltage-Max |
200 V
|
|
Reverse Recovery Time-Max |
2 µs
|
0.06 µs
|
Surface Mount |
NO
|
YES
|
Terminal Finish |
TIN LEAD
|
|
Terminal Form |
WIRE
|
GULL WING
|
Terminal Position |
AXIAL
|
DUAL
|
Base Number Matches |
1
|
1
|
Forward Voltage-Max (VF) |
|
1.2 V
|
Non-rep Pk Forward Current-Max |
|
2 A
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Power Dissipation-Max |
|
0.15 W
|
Reverse Current-Max |
|
1 µA
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SX5614 with alternatives
Compare 1SS250TE85R with alternatives