SX18
vs
JAN1N4984
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
SEMTECH CORP
MICROCHIP TECHNOLOGY INC
Package Description
O-XALF-W2
HERMETIC SEALED, GLASS PACKAGE-2
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
HTS Code
8541.10.00.50
Additional Feature
LOW DYNAMIC IMPEDANCE
Case Connection
ISOLATED
ISOLATED
Configuration
SINGLE
SINGLE
Diode Element Material
SILICON
SILICON
Diode Type
ZENER DIODE
ZENER DIODE
Dynamic Impedance-Max
2.5 Ω
70 Ω
JESD-30 Code
O-XALF-W2
O-LALF-W2
JESD-609 Code
e0
e0
Number of Elements
1
1
Number of Terminals
2
2
Operating Temperature-Max
200 °C
200 °C
Package Body Material
UNSPECIFIED
GLASS
Package Shape
ROUND
ROUND
Package Style
LONG FORM
LONG FORM
Polarity
UNIDIRECTIONAL
UNIDIRECTIONAL
Power Dissipation-Max
5 W
5 W
Qualification Status
Not Qualified
Qualified
Reference Voltage-Nom
18 V
120 V
Reverse Current-Max
5 µA
Surface Mount
NO
NO
Technology
ZENER
ZENER
Terminal Finish
TIN LEAD
Tin/Lead (Sn/Pb)
Terminal Form
WIRE
WIRE
Terminal Position
AXIAL
AXIAL
Voltage Temp Coeff-Max
15.3 mV/°C
Voltage Tol-Max
5%
5%
Working Test Current
65 mA
10 mA
Base Number Matches
1
9
Factory Lead Time
28 Weeks
Reference Standard
MIL-19500/356H
Compare SX18 with alternatives
Compare JAN1N4984 with alternatives