SUD45N05-20L
vs
RFD3055SM
feature comparison
Rohs Code |
No
|
No
|
Part Life Cycle Code |
Transferred
|
Active
|
Ihs Manufacturer |
SILICONIX INC
|
ROCHESTER ELECTRONICS LLC
|
Part Package Code |
TO-252
|
TO-252AA
|
Package Description |
,
|
DPAK-3
|
Pin Count |
4
|
3
|
Reach Compliance Code |
unknown
|
unknown
|
ECCN Code |
EAR99
|
|
Samacsys Manufacturer |
Vishay
|
|
Configuration |
SINGLE
|
SINGLE WITH BUILT-IN DIODE
|
Drain Current-Max (ID) |
43 A
|
12 A
|
FET Technology |
METAL-OXIDE SEMICONDUCTOR
|
METAL-OXIDE SEMICONDUCTOR
|
JESD-609 Code |
e0
|
e0
|
Number of Elements |
1
|
1
|
Operating Mode |
ENHANCEMENT MODE
|
ENHANCEMENT MODE
|
Operating Temperature-Max |
175 °C
|
|
Polarity/Channel Type |
N-CHANNEL
|
N-CHANNEL
|
Power Dissipation-Max (Abs) |
75 W
|
|
Surface Mount |
YES
|
YES
|
Terminal Finish |
Tin/Lead (Sn/Pb)
|
TIN LEAD
|
Base Number Matches |
2
|
2
|
Pbfree Code |
|
Yes
|
Case Connection |
|
DRAIN
|
DS Breakdown Voltage-Min |
|
60 V
|
Drain-source On Resistance-Max |
|
0.15 Ω
|
JEDEC-95 Code |
|
TO-252AA
|
JESD-30 Code |
|
R-PSSO-G2
|
Number of Terminals |
|
2
|
Package Body Material |
|
PLASTIC/EPOXY
|
Package Shape |
|
RECTANGULAR
|
Package Style |
|
SMALL OUTLINE
|
Peak Reflow Temperature (Cel) |
|
NOT SPECIFIED
|
Qualification Status |
|
COMMERCIAL
|
Terminal Form |
|
GULL WING
|
Terminal Position |
|
SINGLE
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
Transistor Application |
|
SWITCHING
|
Transistor Element Material |
|
SILICON
|
|
|
|
Compare SUD45N05-20L with alternatives
Compare RFD3055SM with alternatives