STPCD0112BTC3
vs
MCF5472ZP200
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
STMICROELECTRONICS
MOTOROLA INC
Part Package Code
BGA
Package Description
35 X 35 MM, PLASTIC, BGA-388
27 X 27 MM, 1 MM PITCH, PLASTIC, MS-034AAL-1, BGA-388
Pin Count
388
Reach Compliance Code
not_compliant
unknown
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Address Bus Width
32
32
Bit Size
32
32
Boundary Scan
NO
YES
Clock Frequency-Max
120 MHz
66.66 MHz
External Data Bus Width
64
32
Format
FLOATING POINT
FLOATING POINT
Integrated Cache
YES
YES
JESD-30 Code
S-PBGA-B388
S-PBGA-B388
JESD-609 Code
e0
Length
35 mm
27 mm
Low Power Mode
YES
YES
Number of Terminals
388
388
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
BGA
Package Equivalence Code
BGA388,26X26,50
BGA388,26X26,40
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY
GRID ARRAY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.38 mm
2.55 mm
Speed
120 MHz
200 MHz
Supply Voltage-Max
3.6 V
1.58 V
Supply Voltage-Min
3 V
1.43 V
Supply Voltage-Nom
3.3 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1.27 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
35 mm
27 mm
uPs/uCs/Peripheral ICs Type
MICROPROCESSOR
MICROPROCESSOR, RISC
Base Number Matches
1
4
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