STP1100BGA-100
vs
SPC5200CBV466B
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
SUN MICROSYSTEMS INC
|
FREESCALE SEMICONDUCTOR INC
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
BGA, BGA272,20X20,50
|
27 X 27 MM, 1.27 MM PITCH, HALIDE FREE, PLASTIC, BGA-272
|
| Pin Count |
272
|
272
|
| Reach Compliance Code |
unknown
|
not_compliant
|
| ECCN Code |
3A991.A.2
|
3A991
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Address Bus Width |
32
|
32
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
YES
|
| Clock Frequency-Max |
33.33 MHz
|
35 MHz
|
| External Data Bus Width |
32
|
32
|
| Format |
FLOATING POINT
|
FIXED POINT
|
| Integrated Cache |
YES
|
YES
|
| JESD-30 Code |
S-PBGA-B272
|
S-PBGA-B272
|
| Length |
27 mm
|
27 mm
|
| Low Power Mode |
YES
|
YES
|
| Number of DMA Channels |
|
|
| Number of External Interrupts |
15
|
|
| Number of Serial I/Os |
|
|
| Number of Terminals |
272
|
272
|
| On Chip Data RAM Width |
|
|
| Operating Temperature-Max |
80 °C
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA272,20X20,50
|
BGA272,20X20,50
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (words) |
0
|
|
| Seated Height-Max |
2.54 mm
|
2.65 mm
|
| Speed |
100 MHz
|
466 MHz
|
| Supply Voltage-Max |
3.47 V
|
1.58 V
|
| Supply Voltage-Min |
3.14 V
|
1.42 V
|
| Supply Voltage-Nom |
3.3 V
|
1.5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL EXTENDED
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
27 mm
|
27 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROPROCESSOR, RISC
|
MICROPROCESSOR
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
No
|
| Rohs Code |
|
No
|
| Additional Feature |
|
ALSO REQUIRES 3.3V SUPPLY
|
| JESD-609 Code |
|
e0
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
245
|
| Screening Level |
|
AEC-Q100
|
| Terminal Finish |
|
TIN LEAD
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare STP1100BGA-100 with alternatives
Compare SPC5200CBV466B with alternatives