STM8AF6176TCR
vs
HD407A4359RH
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
RENESAS TECHNOLOGY CORP
|
| Part Package Code |
QFP
|
QFP
|
| Package Description |
LQFP, QFP32,.35SQ,32
|
QFP,
|
| Pin Count |
32
|
44
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
|
| Bit Size |
8
|
4
|
| Boundary Scan |
NO
|
|
| CPU Family |
STM8
|
|
| Clock Frequency-Max |
24 MHz
|
|
| DAC Channels |
NO
|
|
| DMA Channels |
NO
|
|
| Format |
FIXED POINT
|
|
| Integrated Cache |
NO
|
|
| JESD-30 Code |
S-PQFP-G32
|
S-PQFP-G44
|
| Length |
7 mm
|
14 mm
|
| Low Power Mode |
YES
|
|
| Number of External Interrupts |
37
|
|
| Number of I/O Lines |
25
|
|
| Number of Terminals |
32
|
44
|
| On Chip Data RAM Width |
8
|
|
| On Chip Program ROM Width |
8
|
|
| Operating Temperature-Max |
125 °C
|
|
| Operating Temperature-Min |
-40 °C
|
|
| PWM Channels |
YES
|
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LQFP
|
QFP
|
| Package Equivalence Code |
QFP32,.35SQ,32
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
3072
|
|
| RAM (words) |
3072
|
|
| ROM (words) |
49152
|
|
| ROM Programmability |
FLASH
|
|
| Seated Height-Max |
1.6 mm
|
3.05 mm
|
| Speed |
24 MHz
|
|
| Supply Voltage-Max |
5.5 V
|
|
| Supply Voltage-Min |
3 V
|
|
| Supply Voltage-Nom |
3.3 V
|
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
|
| Terminal Form |
GULL WING
|
GULL WING
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
7 mm
|
14 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
| Base Number Matches |
1
|
2
|
|
|
|
Compare STM8AF6176TCR with alternatives
Compare HD407A4359RH with alternatives