STM32L152VEY6D
vs
STM32L152VEY7
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Package Description
VFBGA,
VFBGA,
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Clock Frequency-Max
24 MHz
24 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
R-PBGA-B104
R-PBGA-B104
Length
5.094 mm
5.094 mm
Number of I/O Lines
83
83
Number of Terminals
104
104
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
ROM (words)
524288
524288
ROM Programmability
FLASH
FLASH
Seated Height-Max
0.585 mm
0.585 mm
Speed
32 MHz
32 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3.3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.4 mm
0.4 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
4.095 mm
4.095 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
4
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