STM32L151UCY7TR
vs
STM32L151UCY6TR
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
3A991.A.2
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Factory Lead Time |
15 Weeks
|
15 Weeks
|
| Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
|
|
| Bit Size |
32
|
32
|
| CPU Family |
CORTEX-M3
|
CORTEX-M3
|
| Clock Frequency-Max |
24 MHz
|
24 MHz
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
|
|
| JESD-30 Code |
R-PBGA-B63
|
R-PBGA-B63
|
| Length |
4.164 mm
|
4.164 mm
|
| Number of I/O Lines |
51
|
51
|
| Number of Terminals |
63
|
63
|
| Operating Temperature-Max |
105 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
VFBGA
|
| Package Equivalence Code |
BGA63,7X9,16
|
BGA63,7X9,16
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| RAM (bytes) |
32768
|
32768
|
| ROM (words) |
262144
|
262144
|
| ROM Programmability |
FLASH
|
FLASH
|
| Speed |
32 MHz
|
32 MHz
|
| Supply Current-Max |
9.6 mA
|
12.3 mA
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
1.8 V
|
3 V
|
| Supply Voltage-Nom |
3 V
|
3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.4 mm
|
0.4 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
3.288 mm
|
3.228 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
WLCSP-63
|
| DAC Channels |
|
YES
|
| JESD-609 Code |
|
e1
|
| Moisture Sensitivity Level |
|
1
|
| On Chip Program ROM Width |
|
8
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Seated Height-Max |
|
0.6 mm
|
| Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
| Time@Peak Reflow Temperature-Max (s) |
|
30
|
|
|
|
Compare STM32L151UCY7TR with alternatives
Compare STM32L151UCY6TR with alternatives