STM32L151R8H6DTR
vs
STM32L151R8T6AD
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
BGA
Package Description
TFBGA, BGA64,8X8,20
LFQFP,
Pin Count
64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
32 MHz
32 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B64
S-PQFP-G64
Length
5 mm
10 mm
Number of I/O Lines
51
51
Number of Terminals
64
64
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
LFQFP
Package Equivalence Code
BGA64,8X8,20
QFP64,.47SQ,20
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
FLATPACK, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
NOT SPECIFIED
Qualification Status
Not Qualified
RAM (bytes)
10240
32768
ROM (words)
65536
65536
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
1.6 mm
Speed
32 MHz
32 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3 V
3 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
NOT SPECIFIED
Width
5 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Integrated Cache
NO
Low Power Mode
YES
Number of DMA Channels
7
Number of External Interrupts
16
Number of Serial I/Os
3
Number of Timers
6
On Chip Data RAM Width
8
RAM (words)
32768
Supply Current-Max
100 mA
Compare STM32L151R8H6DTR with alternatives
Compare STM32L151R8T6AD with alternatives