STM32L071RZH7
vs
STM32L071RZH6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Package Description
TFBGA-64
TFBGA-64
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.A.2
3A991.A.2
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
NO
NO
CPU Family
CORTEX-M0
CORTEX-M0
Clock Frequency-Max
32 MHz
32 MHz
DAC Channels
NO
NO
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B64
S-PBGA-B64
Length
5 mm
5 mm
Number of DMA Channels
7
7
Number of I/O Lines
50
50
Number of Terminals
64
64
Number of Timers
8
8
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
ROM (words)
196608
196608
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.2 mm
1.2 mm
Speed
32 MHz
32 MHz
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
1.65 V
1.65 V
Supply Voltage-Nom
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
BOTTOM
BOTTOM
Width
5 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
Manufacturer Package Code
TFBGA 64 5x5x1.2
Factory Lead Time
15 Weeks
Samacsys Manufacturer
STMicroelectronics
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare STM32L071RZH7 with alternatives
Compare STM32L071RZH6 with alternatives