STM32F429BET6TR
vs
STM32F429NEH6
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Package Description |
LFQFP, QFP208,1.2SQ,20
|
TFBGA-216
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
26
|
|
Bit Size |
32
|
32
|
Boundary Scan |
YES
|
|
CPU Family |
CORTEX-M4
|
CORTEX-M4
|
Clock Frequency-Max |
26 MHz
|
50 MHz
|
DAC Channels |
YES
|
YES
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
32
|
|
Format |
FLOATING POINT
|
|
Integrated Cache |
NO
|
|
JESD-30 Code |
S-PQFP-G208
|
S-PBGA-B216
|
Length |
28 mm
|
13 mm
|
Low Power Mode |
YES
|
|
Number of DMA Channels |
2
|
2
|
Number of External Interrupts |
16
|
|
Number of I/O Lines |
168
|
168
|
Number of Serial I/Os |
6
|
|
Number of Terminals |
208
|
216
|
Number of Timers |
15
|
17
|
On Chip Data RAM Width |
8
|
|
On Chip Program ROM Width |
8
|
8
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LFQFP
|
TFBGA
|
Package Equivalence Code |
QFP208,1.2SQ,20
|
BGA216,15X15,32
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
RAM (bytes) |
266240
|
262144
|
ROM (words) |
524288
|
524288
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
1.1 mm
|
Speed |
180 MHz
|
180 MHz
|
Supply Current-Max |
100 mA
|
140 mA
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
3.3 V
|
3.3 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Form |
GULL WING
|
BALL
|
Terminal Pitch |
0.5 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
BOTTOM
|
Width |
28 mm
|
13 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
1
|
1
|
Factory Lead Time |
|
19 Weeks
|
Samacsys Manufacturer |
|
STMicroelectronics
|
JESD-609 Code |
|
e1
|
Moisture Sensitivity Level |
|
3
|
Peak Reflow Temperature (Cel) |
|
260
|
Qualification Status |
|
Not Qualified
|
Terminal Finish |
|
Tin/Silver/Copper (Sn/Ag/Cu)
|
Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare STM32F429BET6TR with alternatives
Compare STM32F429NEH6 with alternatives