STM32F217IGH6VXXX
vs
STM32F217IGT7
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Package Description |
VFBGA, BGA201,15X15,25
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
3A991.A.2
|
5A992.C
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Has ADC |
YES
|
YES
|
| Address Bus Width |
26
|
26
|
| Bit Size |
32
|
32
|
| Boundary Scan |
YES
|
|
| CPU Family |
CORTEX-M3
|
CORTEX-M3
|
| Clock Frequency-Max |
26 MHz
|
26 MHz
|
| DAC Channels |
YES
|
YES
|
| DMA Channels |
YES
|
YES
|
| External Data Bus Width |
16
|
16
|
| Format |
FIXED POINT
|
|
| JESD-30 Code |
S-PBGA-B201
|
S-PQFP-G176
|
| Length |
10 mm
|
24 mm
|
| Low Power Mode |
YES
|
|
| Number of DMA Channels |
2
|
16
|
| Number of External Interrupts |
16
|
|
| Number of I/O Lines |
140
|
140
|
| Number of Terminals |
201
|
176
|
| Number of Timers |
17
|
16
|
| On Chip Program ROM Width |
8
|
8
|
| Operating Temperature-Max |
85 °C
|
105 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| PWM Channels |
YES
|
YES
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
VFBGA
|
LQFP
|
| Package Equivalence Code |
BGA201,15X15,25
|
QFP176,1.0SQ,20
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
|
FLATPACK
|
| RAM (bytes) |
135168
|
131072
|
| ROM (words) |
1048576
|
1048576
|
| ROM Programmability |
FLASH
|
FLASH
|
| Seated Height-Max |
0.6 mm
|
|
| Speed |
120 MHz
|
120 MHz
|
| Supply Voltage-Max |
3.6 V
|
3.6 V
|
| Supply Voltage-Min |
3.3 V
|
2.7 V
|
| Supply Voltage-Nom |
3.3 V
|
2.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Form |
BALL
|
GULL WING
|
| Terminal Pitch |
0.65 mm
|
0.5 mm
|
| Terminal Position |
BOTTOM
|
QUAD
|
| Width |
10 mm
|
24 mm
|
| uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
| Base Number Matches |
1
|
1
|
| Part Package Code |
|
QFP
|
| Pin Count |
|
176
|
| Factory Lead Time |
|
15 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
3
|
| Peak Reflow Temperature (Cel) |
|
260
|
| Qualification Status |
|
Not Qualified
|
| Supply Current-Max |
|
93 mA
|
| Terminal Finish |
|
Matte Tin (Sn)
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare STM32F217IGH6VXXX with alternatives
Compare STM32F217IGT7 with alternatives