STM32F103ZDH7
vs
STM32F103ZDH6
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Package Description
LFBGA, BGA144,12X12,32
LFBGA-144
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Samacsys Manufacturer
STMicroelectronics
STMicroelectronics
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
YES
YES
DMA Channels
YES
YES
External Data Bus Width
JESD-30 Code
S-PBGA-B144
S-PBGA-B144
Length
10 mm
10 mm
Number of DMA Channels
Number of I/O Lines
112
112
Number of Terminals
144
144
Number of Timers
7
7
On Chip Program ROM Width
8
8
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFBGA
LFBGA
Package Equivalence Code
BGA144,12X12,32
BGA144,12X12,32
Package Shape
SQUARE
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
NOT SPECIFIED
260
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
65536
ROM (words)
393216
393216
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.7 mm
1.7 mm
Speed
72 MHz
72 MHz
Supply Current-Max
70 mA
70 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
3.3 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
30
Width
10 mm
10 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
144
ECCN Code
3A991.A.2
Factory Lead Time
13 Weeks
JESD-609 Code
e1
Moisture Sensitivity Level
3
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
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