STM32F103RDT6XXX
vs
STM32F103RBH7
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
Rohs Code
Yes
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
STMICROELECTRONICS
STMICROELECTRONICS
Part Package Code
QFP
BGA
Package Description
LFQFP, QFP64,.47SQ,20
Pin Count
64
64
Reach Compliance Code
compliant
compliant
HTS Code
8542.31.00.01
8542.31.00.01
Has ADC
YES
YES
Address Bus Width
Bit Size
32
32
Boundary Scan
YES
CPU Family
CORTEX-M3
CORTEX-M3
Clock Frequency-Max
16 MHz
16 MHz
DAC Channels
YES
DMA Channels
YES
YES
External Data Bus Width
Format
FIXED POINT
Integrated Cache
NO
JESD-30 Code
S-PQFP-G64
S-PBGA-B64
Length
10 mm
5 mm
Low Power Mode
YES
Number of DMA Channels
12
Number of External Interrupts
16
Number of I/O Lines
51
51
Number of Terminals
64
64
Number of Timers
11
On Chip Program ROM Width
8
8
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
-40 °C
PWM Channels
YES
YES
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LFQFP
FBGA
Package Equivalence Code
QFP64,.47SQ,20
BGA64,8X8,20
Package Shape
SQUARE
SQUARE
Package Style
FLATPACK, LOW PROFILE, FINE PITCH
GRID ARRAY, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
RAM (bytes)
65536
20480
ROM (words)
393216
131072
ROM Programmability
FLASH
FLASH
Seated Height-Max
1.6 mm
Speed
72 MHz
72 MHz
Supply Current-Max
69 mA
50.3 mA
Supply Voltage-Max
3.6 V
3.6 V
Supply Voltage-Min
3.3 V
2 V
Supply Voltage-Nom
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
BALL
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
BOTTOM
Width
10 mm
5 mm
uPs/uCs/Peripheral ICs Type
MICROCONTROLLER, RISC
MICROCONTROLLER, RISC
Base Number Matches
2
4
ECCN Code
3A991.A.2
Factory Lead Time
13 Weeks
Samacsys Manufacturer
STMicroelectronics
JESD-609 Code
e1
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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