STM32F031F4P6
vs
STM32F031F4P6XXX
feature comparison
Rohs Code |
Yes
|
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Package Description |
TSSOP-20
|
TSSOP,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Factory Lead Time |
10 Weeks
|
|
Samacsys Manufacturer |
STMicroelectronics
|
STMicroelectronics
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
|
Bit Size |
32
|
32
|
Clock Frequency-Max |
32 MHz
|
32 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
|
JESD-30 Code |
R-PDSO-G20
|
R-PDSO-G20
|
JESD-609 Code |
e4
|
|
Length |
6.5 mm
|
6.5 mm
|
Moisture Sensitivity Level |
1
|
|
Number of I/O Lines |
15
|
15
|
Number of Terminals |
20
|
20
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
TSSOP
|
TSSOP
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
Peak Reflow Temperature (Cel) |
260
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.2 mm
|
1.2 mm
|
Speed |
48 MHz
|
48 MHz
|
Supply Voltage-Max |
3.6 V
|
3.6 V
|
Supply Voltage-Min |
2 V
|
2 V
|
Supply Voltage-Nom |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
Nickel/Palladium/Gold (Ni/Pd/Au)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
DUAL
|
DUAL
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
|
Width |
4.4 mm
|
4.4 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER, RISC
|
MICROCONTROLLER, RISC
|
Base Number Matches |
3
|
1
|
|
|
|
Compare STM32F031F4P6 with alternatives
Compare STM32F031F4P6XXX with alternatives