ST92F124R9T6
vs
ST92F124R9T3
feature comparison
Pbfree Code |
Yes
|
|
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
QFP
|
QFP
|
Package Description |
14 X 14 MM, TQFP-64
|
14 X 14 MM, TQFP-64
|
Pin Count |
64
|
64
|
Reach Compliance Code |
unknown
|
compliant
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
|
11
|
Bit Size |
16
|
16
|
CPU Family |
ST9
|
|
Clock Frequency-Max |
5 MHz
|
5 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
YES
|
YES
|
External Data Bus Width |
|
8
|
JESD-30 Code |
S-PQFP-G64
|
S-PQFP-G64
|
JESD-609 Code |
e1
|
|
Length |
14 mm
|
14 mm
|
Moisture Sensitivity Level |
3
|
|
Number of I/O Lines |
48
|
48
|
Number of Terminals |
64
|
64
|
On Chip Program ROM Width |
8
|
|
Operating Temperature-Max |
85 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
LQFP
|
QFP
|
Package Equivalence Code |
QFP64,.66SQ,32
|
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK, LOW PROFILE
|
FLATPACK
|
Peak Reflow Temperature (Cel) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
2048
|
|
ROM (words) |
65536
|
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
1.6 mm
|
3.4 mm
|
Speed |
24 MHz
|
24 MHz
|
Supply Current-Max |
60 mA
|
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
HCMOS
|
HCMOS
|
Temperature Grade |
INDUSTRIAL
|
AUTOMOTIVE
|
Terminal Finish |
Tin/Silver/Copper (Sn/Ag/Cu)
|
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.8 mm
|
0.8 mm
|
Terminal Position |
QUAD
|
QUAD
|
Time@Peak Reflow Temperature-Max (s) |
NOT SPECIFIED
|
NOT SPECIFIED
|
Width |
14 mm
|
14 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
|
|
|