ST1S09PU
vs
ST1S09PUR
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Active
|
Active
|
| Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
| Part Package Code |
DFN
|
DFN
|
| Package Description |
HVSON, SOLCC6,.11,37
|
3 X 3 MM, ROHS COMPLIANT, DFN-6
|
| Pin Count |
6
|
6
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Analog IC - Other Type |
SWITCHING REGULATOR
|
SWITCHING REGULATOR
|
| Control Mode |
CURRENT-MODE
|
CURRENT-MODE
|
| Control Technique |
PULSE WIDTH MODULATION
|
PULSE WIDTH MODULATION
|
| Input Voltage-Max |
6 V
|
6 V
|
| Input Voltage-Min |
2.7 V
|
2.7 V
|
| Input Voltage-Nom |
5 V
|
5 V
|
| JESD-30 Code |
S-XDSO-N6
|
S-PDSO-N6
|
| Length |
3 mm
|
3 mm
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
6
|
6
|
| Output Current-Max |
3.5 A
|
3.5 A
|
| Package Body Material |
UNSPECIFIED
|
PLASTIC/EPOXY
|
| Package Code |
HVSON
|
HVSON
|
| Package Equivalence Code |
SOLCC6,.11,37
|
SOLCC6,.11,37
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1 mm
|
1 mm
|
| Surface Mount |
YES
|
YES
|
| Switcher Configuration |
BUCK
|
BUCK
|
| Switching Frequency-Max |
1800 kHz
|
1800 kHz
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
0.95 mm
|
0.95 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Time@Peak Reflow Temperature-Max (s) |
40
|
30
|
| Width |
3 mm
|
3 mm
|
| Base Number Matches |
2
|
1
|
| Factory Lead Time |
|
16 Weeks
|
| Samacsys Manufacturer |
|
STMicroelectronics
|
| JESD-609 Code |
|
e3
|
| Moisture Sensitivity Level |
|
1
|
| Terminal Finish |
|
Matte Tin (Sn) - annealed
|
|
|
|
Compare ST1S09PU with alternatives
Compare ST1S09PUR with alternatives