ST16C554DIJ68TR-F
vs
XR16M554IV80
feature comparison
| Rohs Code |
Yes
|
No
|
| Part Life Cycle Code |
Transferred
|
Obsolete
|
| Ihs Manufacturer |
EXAR CORP
|
MAXLINEAR INC
|
| Package Description |
PLASTIC, LCC-68
|
LFQFP,
|
| Reach Compliance Code |
compliant
|
compliant
|
| HTS Code |
8542.31.00.01
|
8542.31.00.01
|
| Additional Feature |
ALSO OPERATES AT 3.3 V TYP SUPPLY AT 8 MHZ
|
|
| Address Bus Width |
3
|
3
|
| Boundary Scan |
NO
|
NO
|
| Clock Frequency-Max |
24 MHz
|
64 MHz
|
| Communication Protocol |
ASYNC, BIT
|
ASYNC, BIT; SYNC, BYTE; ETHERNET
|
| Data Encoding/Decoding Method |
NRZ
|
|
| Data Transfer Rate-Max |
0.1875 MBps
|
0.5 MBps
|
| External Data Bus Width |
8
|
8
|
| JESD-30 Code |
S-PQCC-J68
|
S-PQFP-G80
|
| JESD-609 Code |
e3
|
|
| Length |
24.23 mm
|
12 mm
|
| Low Power Mode |
NO
|
NO
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Serial I/Os |
4
|
4
|
| Number of Terminals |
68
|
80
|
| Operating Temperature-Max |
85 °C
|
85 °C
|
| Operating Temperature-Min |
-40 °C
|
-40 °C
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
LFQFP
|
| Package Equivalence Code |
LDCC68,1.0SQ
|
|
| Package Shape |
SQUARE
|
SQUARE
|
| Package Style |
CHIP CARRIER
|
FLATPACK
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
5.08 mm
|
1.6 mm
|
| Supply Voltage-Max |
5.5 V
|
3.63 V
|
| Supply Voltage-Min |
4.5 V
|
1.62 V
|
| Supply Voltage-Nom |
5 V
|
3.3 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
| Terminal Finish |
MATTE TIN
|
|
| Terminal Form |
J BEND
|
GULL WING
|
| Terminal Pitch |
1.27 mm
|
0.5 mm
|
| Terminal Position |
QUAD
|
QUAD
|
| Width |
24.23 mm
|
12 mm
|
| uPs/uCs/Peripheral ICs Type |
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
|
| Base Number Matches |
2
|
2
|
|
|
|
Compare ST16C554DIJ68TR-F with alternatives
Compare XR16M554IV80 with alternatives