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ST16C554CQ64-F vs SC16C554DIA68,512 feature comparison

ST16C554CQ64-F Exar Corporation

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SC16C554DIA68,512 NXP Semiconductors

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Pbfree Code Yes
Rohs Code Yes Yes
Part Life Cycle Code Transferred Obsolete
Ihs Manufacturer EXAR CORP NXP SEMICONDUCTORS
Part Package Code QFP LCC
Package Description LFQFP, QFP64,.47SQ,20 QCCJ, LDCC68,1.0SQ
Pin Count 64 68
Reach Compliance Code compliant compliant
HTS Code 8542.31.00.01 8542.31.00.01
Samacsys Manufacturer EXAR
Additional Feature ALSO OPERATES AT 2.97 V MINIMUM SUPPLY OPERATES AT 2.25 V MINIMUM SUPPLY
Address Bus Width 3 5
Boundary Scan NO NO
Clock Frequency-Max 24 MHz 80 MHz
Communication Protocol ASYNC, BIT ASYNC, BIT
Data Encoding/Decoding Method NRZ
Data Transfer Rate-Max 0.1875 MBps 0.625 MBps
External Data Bus Width 8 8
JESD-30 Code S-PQFP-G64 S-PQCC-J68
JESD-609 Code e3
Length 10 mm 24.23 mm
Low Power Mode NO YES
Moisture Sensitivity Level 3
Number of Serial I/Os 4 4
Number of Terminals 64 68
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFQFP QCCJ
Package Equivalence Code QFP64,.47SQ,20 LDCC68,1.0SQ
Package Shape SQUARE SQUARE
Package Style FLATPACK, LOW PROFILE, FINE PITCH CHIP CARRIER
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 4.57 mm
Supply Voltage-Max 5.5 V 3.63 V
Supply Voltage-Min 4.5 V 2.97 V
Supply Voltage-Nom 5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish MATTE TIN
Terminal Form GULL WING J BEND
Terminal Pitch 0.5 mm 1.27 mm
Terminal Position QUAD QUAD
Width 10 mm 24.23 mm
uPs/uCs/Peripheral ICs Type SERIAL IO/COMMUNICATION CONTROLLER, SERIAL SERIAL IO/COMMUNICATION CONTROLLER, SERIAL
Base Number Matches 2 1
Peak Reflow Temperature (Cel) 245
Microcontrollers and Processors » Serial IO/Communication Controllers
Microcontrollers and Processors » Serial IO/Communication Controllers

Compare ST16C554CQ64-F with alternatives

Compare SC16C554DIA68,512 with alternatives