ST10F168-Q2
vs
ST10F168-Q3
feature comparison
Rohs Code |
No
|
Yes
|
Part Life Cycle Code |
Obsolete
|
Obsolete
|
Ihs Manufacturer |
STMICROELECTRONICS
|
STMICROELECTRONICS
|
Part Package Code |
QFP
|
QFP
|
Package Description |
28 X 28 MM, PLASTIC, QFP-144
|
28 X 28 MM, PLASTIC, QFP-144
|
Pin Count |
144
|
144
|
Reach Compliance Code |
not_compliant
|
compliant
|
ECCN Code |
3A991.A.2
|
3A991.A.2
|
HTS Code |
8542.31.00.01
|
8542.31.00.01
|
Has ADC |
YES
|
YES
|
Address Bus Width |
24
|
24
|
Bit Size |
16
|
16
|
CPU Family |
ST10
|
ST10
|
Clock Frequency-Max |
50 MHz
|
50 MHz
|
DAC Channels |
NO
|
NO
|
DMA Channels |
NO
|
NO
|
External Data Bus Width |
16
|
16
|
JESD-30 Code |
S-PQFP-G144
|
S-PQFP-G144
|
JESD-609 Code |
e0
|
e4
|
Length |
28 mm
|
28 mm
|
Number of I/O Lines |
111
|
111
|
Number of Terminals |
144
|
144
|
Operating Temperature-Max |
125 °C
|
125 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
PWM Channels |
YES
|
YES
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
QFP
|
QFP
|
Package Equivalence Code |
QFP144,1.2SQ
|
QFP144,1.2SQ
|
Package Shape |
SQUARE
|
SQUARE
|
Package Style |
FLATPACK
|
FLATPACK
|
Qualification Status |
Not Qualified
|
Not Qualified
|
RAM (bytes) |
8192
|
8192
|
ROM Programmability |
FLASH
|
FLASH
|
Seated Height-Max |
4.07 mm
|
4.07 mm
|
Speed |
25 MHz
|
25 MHz
|
Supply Current-Max |
170 mA
|
170 mA
|
Supply Voltage-Max |
5.5 V
|
5.5 V
|
Supply Voltage-Min |
4.5 V
|
4.5 V
|
Supply Voltage-Nom |
5 V
|
5 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
AUTOMOTIVE
|
AUTOMOTIVE
|
Terminal Finish |
TIN LEAD
|
NICKEL PALLADIUM GOLD
|
Terminal Form |
GULL WING
|
GULL WING
|
Terminal Pitch |
0.65 mm
|
0.65 mm
|
Terminal Position |
QUAD
|
QUAD
|
Width |
28 mm
|
28 mm
|
uPs/uCs/Peripheral ICs Type |
MICROCONTROLLER
|
MICROCONTROLLER
|
Base Number Matches |
1
|
1
|
Samacsys Manufacturer |
|
STMicroelectronics
|
On Chip Program ROM Width |
|
8
|
ROM (words) |
|
131072
|
|
|
|