SSTV16859EC-S
vs
ICSSTV16859BKLF
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
BGA
DFN
Package Description
LFBGA,
MLF-56
Pin Count
96
56
Manufacturer Package Code
SOT-536-1
MLF
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
R-PBGA-B96
S-XQCC-N56
Length
13.5 mm
8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
13
13
Number of Functions
1
1
Number of Terminals
96
56
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
UNSPECIFIED
Package Code
LFBGA
VQCCN
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, LOW PROFILE, FINE PITCH
CHIP CARRIER, VERY THIN PROFILE
Propagation Delay (tpd)
2.8 ns
2.6 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.5 mm
1 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
BALL
NO LEAD
Terminal Pitch
0.8 mm
0.5 mm
Terminal Position
BOTTOM
QUAD
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
5.5 mm
8 mm
fmax-Min
200 MHz
210 MHz
Base Number Matches
1
2
Pbfree Code
Rohs Code
JESD-609 Code
e3
Package Equivalence Code
LCC56,.31SQ,20
Terminal Finish
MATTE TIN
Compare SSTV16859EC-S with alternatives
Compare ICSSTV16859BKLF with alternatives