Findchips: Compare SSTV16859EC/G,557 vs SSTV16859EC,518

SSTV16859EC/G,557 vs SSTV16859EC,518 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	NXP SEMICONDUCTORS
Part Package Code	BGA	BGA
Package Description	LFBGA,	LFBGA,
Pin Count	96	96
Manufacturer Package Code	SOT536-1	SOT536-1
Reach Compliance Code	unknown	unknown
Family	SSTV	SSTV
JESD-30 Code	R-PBGA-B96	R-PBGA-B96
Length	13.5 mm	13.5 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	13	13
Number of Functions	1	1
Number of Terminals	96	96
Operating Temperature-Max	70 °C	70 °C
Operating Temperature-Min
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	LFBGA
Package Shape	RECTANGULAR	RECTANGULAR
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	GRID ARRAY, LOW PROFILE, FINE PITCH
Propagation Delay (tpd)	2.8 ns	2.8 ns
Seated Height-Max	1.5 mm	1.5 mm
Supply Voltage-Max (Vsup)	2.7 V	2.7 V
Supply Voltage-Min (Vsup)	2.3 V	2.3 V
Supply Voltage-Nom (Vsup)	2.5 V	2.5 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	COMMERCIAL
Terminal Form	BALL	BALL
Terminal Pitch	0.8 mm	0.8 mm
Terminal Position	BOTTOM	BOTTOM
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	5.5 mm
fmax-Min	200 MHz	200 MHz
Base Number Matches	1	1
Rohs Code		No
HTS Code		8542.39.00.01
Peak Reflow Temperature (Cel)		NOT SPECIFIED
Qualification Status		Not Qualified
Time@Peak Reflow Temperature-Max (s)		NOT SPECIFIED
	Logic » FF/Latches	Logic » FF/Latches