Findchips: Compare SSTV16859EC/G,518 vs IDT74SSTV16859NL8

SSTV16859EC/G,518 vs IDT74SSTV16859NL8 feature comparison

Buy Now Datasheet

Buy Now Datasheet

Part Life Cycle Code	Obsolete	Obsolete
Ihs Manufacturer	NXP SEMICONDUCTORS	INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code	BGA	QFN
Package Description	LFBGA,	HVQCCN, LCC56,.31SQ,20
Pin Count	96	56
Manufacturer Package Code	SOT536-1
Reach Compliance Code	unknown	not_compliant
Family	SSTV	SSTV
JESD-30 Code	R-PBGA-B96	S-PQCC-N56
Length	13.5 mm	8 mm
Logic IC Type	D FLIP-FLOP	D FLIP-FLOP
Number of Bits	13	13
Number of Functions	1	1
Number of Terminals	96	56
Operating Temperature-Max	70 °C	85 °C
Operating Temperature-Min		-40 °C
Output Polarity	TRUE	TRUE
Package Body Material	PLASTIC/EPOXY	PLASTIC/EPOXY
Package Code	LFBGA	HVQCCN
Package Shape	RECTANGULAR	SQUARE
Package Style	GRID ARRAY, LOW PROFILE, FINE PITCH	CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Propagation Delay (tpd)	2.8 ns	2.8 ns
Seated Height-Max	1.5 mm	1 mm
Supply Voltage-Max (Vsup)	2.7 V	2.7 V
Supply Voltage-Min (Vsup)	2.3 V	2.3 V
Supply Voltage-Nom (Vsup)	2.5 V	2.5 V
Surface Mount	YES	YES
Temperature Grade	COMMERCIAL	INDUSTRIAL
Terminal Form	BALL	NO LEAD
Terminal Pitch	0.8 mm	0.5 mm
Terminal Position	BOTTOM	QUAD
Trigger Type	POSITIVE EDGE	POSITIVE EDGE
Width	5.5 mm	8 mm
fmax-Min	200 MHz	200 MHz
Base Number Matches	1	1
Rohs Code		No
HTS Code		8542.39.00.01
JESD-609 Code		e0
Moisture Sensitivity Level		3
Package Equivalence Code		LCC56,.31SQ,20
Peak Reflow Temperature (Cel)		240
Qualification Status		Not Qualified
Technology		TTL
Terminal Finish		Tin/Lead (Sn85Pb15)
Time@Peak Reflow Temperature-Max (s)		30
	Logic » FF/Latches	Logic » FF/Latches