SSTV16859CGLF
vs
935271266157
feature comparison
| Pbfree Code |
Yes
|
|
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
INTEGRATED DEVICE TECHNOLOGY INC
|
NXP SEMICONDUCTORS
|
| Part Package Code |
TSSOP
|
QFN
|
| Package Description |
6.10 MM, 0.50 MM PITCH, TSSOP-64
|
HVQCCN,
|
| Pin Count |
64
|
56
|
| Manufacturer Package Code |
PAG64
|
|
| Reach Compliance Code |
compliant
|
unknown
|
| HTS Code |
8542.39.00.01
|
8542.39.00.01
|
| Family |
SSTV
|
|
| JESD-30 Code |
R-PDSO-G64
|
S-PQCC-N56
|
| JESD-609 Code |
e3
|
|
| Length |
17 mm
|
8 mm
|
| Logic IC Type |
D FLIP-FLOP
|
D FLIP-FLOP
|
| Moisture Sensitivity Level |
1
|
|
| Number of Bits |
13
|
13
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
64
|
56
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Output Polarity |
TRUE
|
TRUE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
TSSOP
|
HVQCCN
|
| Package Equivalence Code |
TSSOP64,.32,20
|
LCC56,.31SQ,20
|
| Package Shape |
RECTANGULAR
|
SQUARE
|
| Package Style |
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
|
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
|
| Peak Reflow Temperature (Cel) |
260
|
NOT SPECIFIED
|
| Propagation Delay (tpd) |
2.7 ns
|
2.8 ns
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.2 mm
|
1 mm
|
| Supply Voltage-Max (Vsup) |
2.7 V
|
2.7 V
|
| Supply Voltage-Min (Vsup) |
2.3 V
|
2.3 V
|
| Supply Voltage-Nom (Vsup) |
2.5 V
|
2.5 V
|
| Surface Mount |
YES
|
YES
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
TIN
|
|
| Terminal Form |
GULL WING
|
NO LEAD
|
| Terminal Pitch |
0.5 mm
|
0.5 mm
|
| Terminal Position |
DUAL
|
QUAD
|
| Trigger Type |
POSITIVE EDGE
|
POSITIVE EDGE
|
| Width |
6.1 mm
|
8 mm
|
| fmax-Min |
200 MHz
|
200 MHz
|
| Base Number Matches |
1
|
1
|
| Time@Peak Reflow Temperature-Max (s) |
|
NOT SPECIFIED
|
|
|
|
Compare SSTV16859CGLF with alternatives
Compare 935271266157 with alternatives