SSTV16859BS,118
vs
IDT74SSTVM16859NL8
feature comparison
All Stats
Differences Only
Pbfree Code
Yes
No
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
NXP SEMICONDUCTORS
INTEGRATED DEVICE TECHNOLOGY INC
Part Package Code
QFN
QFN
Package Description
HVQCCN,
THERMALLY ENHANCED, PLASTIC, QFN-56
Pin Count
56
56
Reach Compliance Code
unknown
compliant
HTS Code
8542.39.00.01
8542.39.00.01
Family
SSTV
SSTV
JESD-30 Code
S-PQCC-N56
S-PQCC-N56
Length
8 mm
8 mm
Logic IC Type
D FLIP-FLOP
D FLIP-FLOP
Number of Bits
13
13
Number of Functions
1
1
Number of Terminals
56
56
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Output Polarity
TRUE
TRUE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
HVQCCN
HVQCCN
Package Equivalence Code
LCC56,.31SQ,20
LCC56,.31SQ,20
Package Shape
SQUARE
SQUARE
Package Style
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel)
260
Propagation Delay (tpd)
2.8 ns
2.9 ns
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Form
NO LEAD
NO LEAD
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
QUAD
QUAD
Time@Peak Reflow Temperature-Max (s)
40
Trigger Type
POSITIVE EDGE
POSITIVE EDGE
Width
8 mm
8 mm
fmax-Min
200 MHz
200 MHz
Base Number Matches
1
2
Rohs Code
No
JESD-609 Code
e0
Moisture Sensitivity Level
3
Technology
TTL
Terminal Finish
TIN LEAD
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